JPH01162246U - - Google Patents

Info

Publication number
JPH01162246U
JPH01162246U JP5580088U JP5580088U JPH01162246U JP H01162246 U JPH01162246 U JP H01162246U JP 5580088 U JP5580088 U JP 5580088U JP 5580088 U JP5580088 U JP 5580088U JP H01162246 U JPH01162246 U JP H01162246U
Authority
JP
Japan
Prior art keywords
glass
insulating substrate
housing
layer
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5580088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0625965Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5580088U priority Critical patent/JPH0625965Y2/ja
Publication of JPH01162246U publication Critical patent/JPH01162246U/ja
Application granted granted Critical
Publication of JPH0625965Y2 publication Critical patent/JPH0625965Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP5580088U 1988-04-25 1988-04-25 ガラス封止形半導体素子収納用パッケージ Expired - Lifetime JPH0625965Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5580088U JPH0625965Y2 (ja) 1988-04-25 1988-04-25 ガラス封止形半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5580088U JPH0625965Y2 (ja) 1988-04-25 1988-04-25 ガラス封止形半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH01162246U true JPH01162246U (en]) 1989-11-10
JPH0625965Y2 JPH0625965Y2 (ja) 1994-07-06

Family

ID=31281701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5580088U Expired - Lifetime JPH0625965Y2 (ja) 1988-04-25 1988-04-25 ガラス封止形半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0625965Y2 (en])

Also Published As

Publication number Publication date
JPH0625965Y2 (ja) 1994-07-06

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